Cree: Difference between revisions
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==XB-D== | ==XB-D== | ||
Very compact LED (the die is mounted on a chip 2.45 mm square opposed to 3.45 mm square for XP series) introduced in February 2012, promising lower cost. Should provide similar brightness to XP-E LED's. First available units were warm white with Q2 brightness bin (at 350mA). This LED is binned at an operating temperature of 85° C instead of 25°, so in order to directly compare its output to other LED's that are typically binned at 25 degrees, the numbers in the table below have been increased by 14% (see [[XB-D output]] for the 85° numbers). Can be driven up to 1000mA. [http://www.cree.com/products/pdf/XLampXB-D.pdf Datasheet], [http://www.cree.com/news-and-events/cree-news/press-releases/2012/january/120111-xbd press release]. | [[File:Creexb-d.jpg|thumb|Cree XB-D is similar to the XT-E but smaller.]]Very compact LED (the die is mounted on a chip 2.45 mm square opposed to 3.45 mm square for XP series) introduced in February 2012, promising lower cost. Should provide similar brightness to XP-E LED's. First available units were warm white with Q2 brightness bin (at 350mA). This LED is binned at an operating temperature of 85° C instead of 25°, so in order to directly compare its output to other LED's that are typically binned at 25 degrees, the numbers in the table below have been increased by 14% (see [[XB-D output]] for the 85° numbers). Can be driven up to 1000mA. [http://www.cree.com/products/pdf/XLampXB-D.pdf Datasheet], [http://www.cree.com/news-and-events/cree-news/press-releases/2012/january/120111-xbd press release]. | ||
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